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Real-time monitoring system for semiconductor packaging process anomalies

Real-time monitoring system for semiconductor packaging process anomalies

Benefits of Implementation (Examples) ○ Reduction of scrap from implementation Improved yield... Vertical launch of new products and assurance of market quality ○ Abolition of pilot chips Reduction of running costs ○ Prediction of PM maintenance timing Increased productivity

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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